Welcome back Charlie - I agree 100% with Brian's words of caution, and would add a few of my own, particularly if you have adhesives, sealants or conformal coatings to be applied following assembly: Verify the compatibility of each of these materials thru the entire environmental range that your product must be subjected to. I have encountered some situations where the compatibility of the residues and the coatings becomes a major problem, resulting in vessication and other messy situations. Regards - Kelly -----Original Message----- From: Brian Ellis <[log in to unmask]> To: [log in to unmask] <[log in to unmask]> Date: Monday, February 21, 2000 9:19 AM Subject: Re: [TN] THANKS and no clean info request >Charlie > >Welcome back. > >I'm sure several responses may help you but, before you short-circuit >all evaluation, please remember the two basic facts: > >1. Water-soluble chemistry gives you the widest operating window >2. "No-clean" chemistry gives you a narrow operating window. > >This means that it is really impossible to just switch, as there are so >many parameters to consider, e.g. solderability of boards and >components, desired reliability of end product etc., etc., etc. Another >point that it is important to realise: the term "no-clean" covers a >multitude of sins and the easiest "no-clean" fluxes/pastes to use are >those which are the most active and may leave the most active residues, >causing future problems. > >I would therefore counsel caution in interpreting the responses to your >enquiry. Caveat emptor. > >Brian > >Charles Barker wrote: >> >> Hello Technetters; >> >> As Steve Gregory let slip last week, I am back on the job. I'm somewhat >> inundated with catching up, so I had not checked back in on TechNet right away. >> >> MANY THANKS for all the prayers and good wishes. They were felt and very much >> appreciated by both my wife and me. I still have a good bit or soreness from the >> trauma of the surgery, but in general, I feel very good. >> >> Now back to the work/no clean thing: >> >> I am asking a BIGGG favor! >> >> I need to take a serious look at switching our process from a water soluble flux >> soldering operation to a no clean one. Normally, I would put several cored wire >> solders, liquid fluxes and solder pastes through a rigorous evaluation process. >> That could be considered re-inventing the wheel, since many of you have probably >> already done that. >> >> If any of you have done this and could share the results (OFF-LINE, of course), >> I would be greatly obliged. >> >> I would like to know which brands, which model numbers, which alloys and under >> what conditions they were tested, as well, of course, as the results. >> >> THANKS A BUNCH!!! >> >> Charlie B. >> [log in to unmask] >> >> ############################################################## >> TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c >> ############################################################## >> To subscribe/unsubscribe, send a message to [log in to unmask] with following text in >> the body: >> To subscribe: SUBSCRIBE TECHNET <your full name> >> To unsubscribe: SIGNOFF TECHNET >> ############################################################## >> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional >> information. >> If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or >> 847-509-9700 ext.5365 >> ############################################################## > >-- >Brian Ellis >Protonique SA >PO Box 78 >CH-1032 Romanel-sur-Lausanne, Switzerland >Voice: +41 21-648 23 34 Fax: +41 21-648 24 11 >E-mail: [log in to unmask] >URL: Technical and consultancy divisions: > http://www.protonique.com > Web services division: > http://www.protonique.com/webserv > >############################################################## >TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c >############################################################## >To subscribe/unsubscribe, send a message to [log in to unmask] with following text in >the body: >To subscribe: SUBSCRIBE TECHNET <your full name> >To unsubscribe: SIGNOFF TECHNET >############################################################## >Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional >information. >If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or >847-509-9700 ext.5365 >############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################