Guys, We have a requirement to run this package in fairly small runs. Anyone had any experience with these that they could share? I am particularly interested in issues such as presence of voids on heat transfer pad solder, stencil aperture design, reflow characteristics. Any info or even potential sources of info would be greatly appreciated. The data supplied by vendor was not really much help, only with the only suggestion being use either a 5 or 6mil stencil. Thanks John Harris Process Engineer AEMS Pty Ltd ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################