This sounds very "interesting" from the configuration of the process application view Rob. Dispense head IS attached to the bond head ?; I'd agree with you on your worries to be indeed in the head scratch category . From what you (so far) described Siamese dissection may be due . But , you must have a pretty (not quite) good reasons (motion elimination?) to go as far as integrating UV lamp into actual (automated, what machine?)xyz enclosure. Otherwise it's a cool solution to double the fly function of Z dispense head as UV carrier (& a clamp!)as well, (only swedes with their modular design school could do as well). Impressive . Hey Rob ; we can perhaps screen it by various means , pending the machine, path program, etc. and i care little if you'd like it off or on line , it entails tedious (verbal) or quick (pdf) connection . Let's see if anybuddy else (last time seen with messy green message, very experienced in those things) bites . Picture (or thousands words) would help . Or draft the configuration over a fax (+61 2 9878 5079). cu paul (libra with gemini) http://www.resmed.com -----Original Message----- From: rob mewes [mailto:[log in to unmask]] Sent: Tuesday, 29 February 2000 18:43 To: [log in to unmask] Subject: [TN] Hi Technetters, Does anyone have any experience they could pass on regarding the automatic dispensing of UV cure epoxy. I am trying to dispense onto a substrate and then whilst holding the component being bonded in place with the bond head cure the material. My only problem is that the dispense head is attached to the bond head and I am worried about the UV material curing in and around the needle. Thanks Bob Mewes _________________________________________________________ Do You Yahoo!? Get your free @yahoo.com address at http://mail.yahoo.com ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ##############################################################