Thanks for the help, i will need all the luck i can get Bill > ---------- > From: rampinc[SMTP:[log in to unmask]] > Reply To: TechNet E-Mail Forum.;rampinc > Sent: Tuesday, February 01, 2000 6:58 PM > To: [log in to unmask] > Subject: Re: [TN] BGA-Multi layer ceramic design > > Sullivan, > Go to the following URL > -http://developer.intel.com/design/packtech/packbook.htm#IntelTop > You will find the help you are looking for. Good Luck. > > "Sullivan, William" wrote: > > > Fellow TechNeter's > > > > I am in sort of a dilemma, I have been AR'ed to develop a design > > process for BGA (multi layer ceramic) packages. Up to this point we have > out > > source the design and fabrication but this is very costly and turn times > are > > unacceptable in the semiconductor industry. I consider myself a seasoned > PCB > > designer with the proper EDA tools in place to aid me, but this is out > of my > > league at the present moment. I could really use some help on gathering > > design guide information,routing, and fabrication on these things. Or > > possibly some one out there that is doing package design can contact me > with > > there phone number. > > > > Thanks William Sullivan C.I.D > > Supervisor Probe Card Design > > > > ############################################################## > > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > > ############################################################## > > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in > > the body: > > To subscribe: SUBSCRIBE TECHNET <your full name> > > To unsubscribe: SIGNOFF TECHNET > > ############################################################## > > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > > information. > > If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] > or > > 847-509-9700 ext.5365 > > ############################################################## > > -- > ____________________________________ > Regards, > Pratap Singh > > Tel./Fax: 512-255-6820, > e-mail: [log in to unmask] or [log in to unmask] > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > information. > If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or > 847-509-9700 ext.5365 > ############################################################## > ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################