got it Charles, twice -----Original Message----- From: Charles E. McMahon [mailto:[log in to unmask]] Sent: Monday, 21 February 2000 15:34 To: [log in to unmask] Subject: Re: [TN] [LF] Components ----- Original Message ----- From: Charles E McMahon <[log in to unmask]> To: <[log in to unmask]> Sent: Sunday, February 20, 2000 11:27 PM Subject: Re: [TN] [LF] Components > Paul; > > ENTEK is an OSP (anti-oxidant) used to coat bare copper boards prior to > assembly. > Upon exposure to reflow temperature it loses its capability to prevent > copper tarnish and needs to be reapplied if you want to stop oxidation. > Normally applied at the board shop after mask. > > Charlie McMahon > > > ----- Original Message ----- > From: Paul Klasek <[log in to unmask]> > To: <[log in to unmask]> > Sent: Sunday, February 20, 2000 5:21 PM > Subject: Re: [TN] [LF] Components > > > > Helps indeed , thx Doug, knew the Nortel (2.5 years in field is not much > > [yet]) & Pan.story , didn't the Castin one . > > What does "Entek PWB pad coating" stands for ? ; organic on copper ? > > > > Paul Klasek > > ResMed > > > > -----Original Message----- > > From: Romm, Doug [mailto:[log in to unmask]] > > Sent: Saturday, 19 February 2000 3:11 > > To: [log in to unmask] > > Subject: Re: [LF] Components > > > > > > > > Paul, > > > > TI data on compatibility with the various lead-free pastes is limited to > > date. I have described our history on this issue with water-soluble and > > no-clean Sn/Pb pastes. I have also described what I have seen from other > > sources that have evaluated Ni/Pd finish components with lead-free pastes. > > If you want any specifics on the TI data I am glad to provide it. > > > > Here are my comments: > > > > 1. In the past, TI has conducted evaluations on Sn/Pb water soluble and > > no-clean type pastes from various vendors. This evaluation can be seen > at: > ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################