Fellow TechNeter's I am in sort of a dilemma, I have been AR'ed to develop a design process for BGA (multi layer ceramic) packages. Up to this point we have out source the design and fabrication but this is very costly and turn times are unacceptable in the semiconductor industry. I consider myself a seasoned PCB designer with the proper EDA tools in place to aid me, but this is out of my league at the present moment. I could really use some help on gathering design guide information,routing, and fabrication on these things. Or possibly some one out there that is doing package design can contact me with there phone number. Thanks William Sullivan C.I.D Supervisor Probe Card Design ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################