Yes Murugan, I do it without the slightest problem. There are a couple of things related to this: -make sure the components are inserted with sufficient pressure the make a good contact with the solder, sine the adhesive cures faster and it will hold the component higher when the paste melts -make sure the insertion is accurate, because no self alignment of the component will happen in the oven for the same reason, the adhesive cures faster. Regards, Ioan > -----Original Message----- > From: Murugan Vasudevan [SMTP:[log in to unmask]] > Sent: Tuesday, February 15, 2000 10:24 AM > To: [log in to unmask] > Subject: [TN] Cure and Reflow > > Hi Technetters, > > Just wondering if anyone of you have done simultaneous > cure of SMD adhesives and reflow of solder paste in > the same pass. Any information/leads on any previous > experiences with this process will be very helpful. > > Thanks, > > Murugan. > __________________________________________________ > Do You Yahoo!? > Talk to your friends online with Yahoo! Messenger. > http://im.yahoo.com > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > information. > If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or > 847-509-9700 ext.5365 > ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################