Yes Murugan,

I do it without the slightest problem.

There are a couple of things related to this:
-make sure the components are inserted with sufficient pressure the make a
good contact with the solder, sine the adhesive cures faster and it will
hold the component higher when the paste melts
-make sure the insertion is accurate, because no self alignment of the
component will happen in the oven for the same reason, the adhesive cures
faster.

Regards,
Ioan

> -----Original Message-----
> From: Murugan Vasudevan [SMTP:[log in to unmask]]
> Sent: Tuesday, February 15, 2000 10:24 AM
> To:   [log in to unmask]
> Subject:      [TN] Cure and Reflow
>
> Hi Technetters,
>
> Just wondering if anyone of you have done simultaneous
> cure of SMD adhesives and reflow of solder paste in
> the same pass. Any information/leads on any previous
> experiences with this process will be very helpful.
>
> Thanks,
>
> Murugan.
> __________________________________________________
> Do You Yahoo!?
> Talk to your friends online with Yahoo! Messenger.
> http://im.yahoo.com
>
> ##############################################################
> TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
> ##############################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
> following text in
> the body:
> To subscribe:   SUBSCRIBE TECHNET <your full name>
> To unsubscribe:   SIGNOFF TECHNET
> ##############################################################
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
> additional
> information.
> If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
> 847-509-9700 ext.5365
> ##############################################################

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################