Hi, Everybody,
At this moment, we have used the dry film
lamination and electro-deposition
photo resist to make the lead frames and PWB
inner layers.
As the liquid photo-resists is more and
more popular to be used for
the PCB inner layers to replace the dry-film
lamination.
Would anybody know the key points of the
roller coaters
and how to keep the good yields of this
methods.
Thanks
Chung J. Lee /
Hsin-Sun