Bretton
There is no such thing like brittle fracture of eutectic tin-lead
solder at temperatures above 0°C. The material creeps so fast that
there is no way to reach any yield strength. I believe that good old
Coffin-Manson is still the best model to describe the low cycle fatigue
( creep ) of SnPb solder. In our estimations the Coffin-Manson exponent
is 1.4 - 1.7 for pure grain-boundary sliding. Actually I had a little
paper in the IEEE Transactions on Components, Packaging and
Manufacturing Technology January 99. But as Werner said, you are going
to open a Pandora Box. Be aware of the bugs in there. Feel free to ask
more.
Best regards
Guenter
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