Steve, Most of us are of the opinion that vias in surface mount pads are a bad deal. If you have a successful process, how about sharing it with the rest of us? > -----Original Message----- > From: Joy, Stephen C [SMTP:[log in to unmask]] > Sent: Monday, January 17, 2000 8:39 AM > To: [log in to unmask] > Subject: Re: [TN] VIAS IN PAD > > Bill, > I have a successful process for this. Please contact me off line for > details. > Steve > > -----Original Message----- > From: Bill Robinson [mailto:[log in to unmask]] > Sent: Monday, January 17, 2000 6:14 AM > To: [log in to unmask] > Subject: [TN] VIAS IN PAD > > > We have pruchased a PWB design for use in one of our products. This > design > has through vias in the surface mount pads. Has anyone had experience > with > this situation? My first concern is losing solder through the via during > reflow. Is there a good way to fill the via and still have a good solder > joint? And what other kinds of problems can we expect? thanks for the > help. > > Bill Robinson > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with > following > text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > information. > If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or > 847-509-9700 ext.5365 > ############################################################## > > ############################################################## > TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c > ############################################################## > To subscribe/unsubscribe, send a message to [log in to unmask] with > following text in > the body: > To subscribe: SUBSCRIBE TECHNET <your full name> > To unsubscribe: SIGNOFF TECHNET > ############################################################## > Please visit IPC web site (http://www.ipc.org/html/forum.htm) for > additional > information. > If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or > 847-509-9700 ext.5365 > ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################