Bill, I have a successful process for this. Please contact me off line for details. Steve -----Original Message----- From: Bill Robinson [mailto:[log in to unmask]] Sent: Monday, January 17, 2000 6:14 AM To: [log in to unmask] Subject: [TN] VIAS IN PAD We have pruchased a PWB design for use in one of our products. This design has through vias in the surface mount pads. Has anyone had experience with this situation? My first concern is losing solder through the via during reflow. Is there a good way to fill the via and still have a good solder joint? And what other kinds of problems can we expect? thanks for the help. Bill Robinson ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ############################################################## ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################