Hai I am one more of the passive technet-addicts. I need clarifications on some Heatsink related info. I am not focussing on thermal issues of any sort. I am more concerned with ways of attaching it. It'd be extremely helpful to hear from any of the experienced people here on any of the following stuff 1. Process and reliability concerns in Heat sink & Heat spreader attach on Flip chip packages (with and without over mold) 2. Issues in attach materials - adhesives, phase change, pressure sensitive tapes etc. It will be great to receive a response from any of you who are currently implementing or have done Heat sink attach to packages. Please be warned of further badger from me. Thanks in advance Balki State University of Binghamton, New York Tel : (607) 7703887 __________________________________________________ Do You Yahoo!? Talk to your friends online with Yahoo! Messenger. http://im.yahoo.com ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################