We use blind resin filled vias in pads for micro BGA devices. With one particular fabricator, we experience dimples in the pads where the resin has been scavenged out and then plated on top. I have been charged with the task of defining the specification for how flat the pads should be. Any help on this one? Regards Edward Brunker Principal Process Engineer Sendo ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################