O.K. try this. Mil-M-38510J, para. 3.5.5.1states "Metallization thickness. For class S microcircuits, the minimum metallization thickness shall be 8,000 A (800 nm) for single level metal and for the top level of multi-level metal, and 5,000 A (500 nm) for the lower level(s) of multi-level metal. In all cases, the current density requirements of 3.5.5 shall also be satisfied. Note on this military standard. Notice 1 issued 27 Aug 1993 turned it inactive for new designs. There might be a better standard out there that I'm not aware of. Glenn Rusty Boyd <[log in to unmask]> Wrote: | | Thanks for the info so far. I also need MilSpec's regarding the Au bond | pad plating thickness for ultrasonic Al wire bonding in the Au on Ni on | Cu system. | Thanks again, | Rusty | | | Rusty Boyd | OUHEP - http://oua4.nhn.ou.edu/ | [log in to unmask] | 24/7 phone number: (405)408-0180 | fax: (405)325-7557 | University of Oklahoma | Dept. of Physics and Astronomy | 440 W. Brooks | Norman, OK 73019 | CERN office: | 40-3-C11 | ph. 767-1170 ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################