Thanks for the info so far. I also need MilSpec's regarding the Au bond pad plating thickness for ultrasonic Al wire bonding in the Au on Ni on Cu system. Thanks again, Rusty Rusty Boyd OUHEP - http://oua4.nhn.ou.edu/ [log in to unmask] 24/7 phone number: (405)408-0180 fax: (405)325-7557 University of Oklahoma Dept. of Physics and Astronomy 440 W. Brooks Norman, OK 73019 CERN office: 40-3-C11 ph. 767-1170 ############################################################## TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c ############################################################## To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TECHNET <your full name> To unsubscribe: SIGNOFF TECHNET ############################################################## Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information. If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or 847-509-9700 ext.5365 ##############################################################