Thanks for the info so far. I also need MilSpec's regarding the Au bond
pad plating thickness for ultrasonic Al wire bonding in the Au on Ni on
Cu system.
Thanks again,
Rusty


Rusty Boyd
OUHEP - http://oua4.nhn.ou.edu/
[log in to unmask]
24/7 phone number: (405)408-0180
fax: (405)325-7557
University of Oklahoma
Dept. of Physics and Astronomy
440 W. Brooks
Norman, OK 73019
CERN office:
40-3-C11
ph. 767-1170

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