John, Some comments (***) - > 3.3.9 Plating Voids. Images "Void at Interface" and "Void at Interface2" > are included here. *** Photos of less severe but still rejectable conditions should be more helpful as a whole. > 3.3.12 Innerlayer Separation - Vertical Microsection. Images "Interface > Separation" and "Interface Separation2" are included here. *** A better defect name would seem to be "Separation at Interface - Vertical" > 3.3.13 Innerlayer Separation - Horizontal Microsection. Images "Z Axis > Separation 1" and "Z Axis Separation 2" are included here. *** A better defect name would seem to be "Separation at Interface - Horizontal" Regards, Karl Sauter | _____ | /____ /\ Karl Sauter, Staff Engineer | /____ \\ \ Sun Microsystems, Inc. | /_____\ \\ / VLSI/Advanced Component Engineering | /_____/ \/ / / 901 San Antonio Road, M/S UMPK15-103 | /_____/ / \//\ Palo Alto, CA 94303-4900 | \_____\//\ / / | \_____/ / /\ / Phone: 650-786-7663 | \_____/ \\ \ Pager: 888-902-1298 | \_____\ \\ FAX : 650-786-3723 | \_____\/ Email: [log in to unmask] | > Date: Thu, 11 May 2000 11:26:57 -0500 > From: John Perry <[log in to unmask]> > Subject: [IPC-600-6012] New Photos for Review > To: [log in to unmask] > > Colleagues, > > I've attached a number of photographs related to lifted lands, negative etchback, plating voids, etc. I'd like the group to review them for possible inclusion within the future visual board acceptance standard, whatever that may turn out to be. > > I'd like to know if any of the following would be more descriptive/useful than what is currently found within the following sections of the IPC-A-600F, for: > > 2.10.3 External Annular Ring. Image "Z Axis misregistration" included here. > > 3.1.5.2 Negative Etchback. Images "Negative Etchback" and "Negative Etchback2" are included here. > > 3.3.2 Lifted Lands. Images "Lifted Land1" and "Lifted Land2" are included here. > > 3.3.3 Plating Crack - Foil. Image "Foil Crack" is included here. > > 3.3.9 Plating Voids. Images "Void at Interface" and "Void at Interface2" are included here. > > 3.3.12 Innerlayer Separation - Vertical Microsection. Images "Interface Separation" and "Interface Separation2" are included here. > > 3.3.13 Innerlayer Separation - Horizontal Microsection. Images "Z Axis Separation 1" and "Z Axis Separation 2" are included here. > > > Looking foward to everyone's input. > > > Best Regards, > > > John Perry > Technical Project Manager > IPC > 2215 Sanders Road > Northbrook, Il 60062 > 1-847-790-5318 (P) > 1-847-509-9798 (F) > [log in to unmask] >