David, 
1)  Electrovert has a class in Elgin, IL once a quarter on wave soldering.

2)  You may want to chart component placement with respect to stuffing accuracy in addition to soldering 

3)  What kind of process are you trying to rewrite? 

4)  Can't help you here, I inherited new equipment

Also, you are going to want to invest in some sort of profiling equipment/methodology.  From what i have gathered over my long months of experience is that a good profile is one of the most critical pieces of good wave soldering.

 


Eric Kalgren
BFGoodrich Aerospace
Data Systems Division
[log in to unmask]
(505) 938-5139

>>> David Hipp <[log in to unmask]> 12/03/99 12:26PM >>>
Hello Techies - We are bringing electronic assembly back into our company
within the next quarter. I will have responsibility for the wave soldering
and cleaning process, and I've never done it before. I LOVE a good
challenge! Background information and our equipment are listed at the end of
the post.

I have saved most of the soldering/cleaning posts since I got on TechNet (~7
months) but I still have a few questions. I know my questions are general,
but I would appreciate your candid responses. Feel free to e-mail me
directly. Thanks for your time and expertise!

1) Is there a seminar/class sponsored by IPC (or anybody for that matter)
that can get me up to speed on what I'll be dealing with? I feel I have a
basic understanding but "I don't know what I don't know".

2) We use SPC extensively here. We were planning to chart solder defects as
the wave soldering result. Is this a good choice? Should we do more than
one? What should we track for cleaning?

3) The old process documentation is dated and very heavy-handed. We want to
start fresh. Are there processes or examples for generating good process
documentation?

4) No capital (yet) available for new/upgraded equipment. What is a good
strategy to maximize our old equipment?

BACKGROUND:
I've been with the company for 17 months. Electronic assembly was farmed out
about five years ago. A changing management and business philosophy now
wants it back in-house.
Our product is single-sided, through hole, with post-wave hand soldering for
wires and such. Board density about 70-80%. Mostly analog, some discrete
digital and one microcontroller-based product. Initial quantity will be
1K-2K boards per year. Manually sprayed-on acrylic conformal coating. Used
in a aircraft prop speed controller mounted inside the cockpit.
My background is in design, then production support engineering.

EQUIPMENT:
Electrovert Microline 250
 - adjustable foam fluxer air pressure, conveyor speed, preheaters, solder
temp, and wave height. Has air knife.
Unitdesign ABC-2001 "dishwasher"
Omega Meter 600R
JetClean Agitator

MATERIALS:
Kester Sn63Pb37 bar solder
Kester 197, rosin soldering flux, type RMA
Unitdesign Aquaclean SAO-10A
Isopropohol alcohol
DI water

Regards,
Dave Hipp
Woodward Aircraft Engine Systems
Electrical Production Engineering

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