<font size=-1></font>

We recently began using 0603 components on the secondary side of the PWB
and attaching them with loctite  3615  epoxy in preparation for wave
solder.   We have a SIEMANS GL-80s dispenser and are using .30mm nozzle.
The problem is we can't seem to maintain a consistant dot size.  This
results in epoxy in the solder joint or in some cases insufficient epoxy to
secure the component.   Has anyone had similar experiences and if so can
you shed some light on how to better control the volume of adhesive
dispensed?
I realize the information I've included here is a bit sketchy.  I'm part of
a design team located remote from our factory and I get the info second
hane since I can't walk domw to the factory and see for myself.
Given that I'de appreciate any advise/info that anyone could provide.

Thanks,
Paul Ziarek
Johnson Controls

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################