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December 1999

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Subject:
From:
Jon Moore <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 3 Dec 1999 07:39:20 EST
Content-Type:
text/plain
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In a message dated 11/30/99 11:21:28 PM US Eastern Standard Time,
[log in to unmask] writes:

>
>  Hoping someone out there can offer me advise or direct me to an
information
> source on wave solder pallets for mask secondary side surface mount
> components (which have been Reflow soldered).
>
I have had some excellent pallets for this purpose made for me by EMC.  I
usually have sent them a finished board with details of what parts or areas
to mask, and they make a prototype.

As a design rule, I have usually requested .050" minimum between parts to be
masked an areas that need to contact the wave.  The more that better is the
general rule to apply.

Jon Moore

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