Anne -

There really isn't a clear cut default position, unless you establish one
with your customer at the time the contract is agreed to.  The problem being
that there are a number of possible reasons for bagging as well as a wide
variety of bag materials and techniques.

If the purpose of bagging is simply to protect the board from its packaging
materials and general dust, then bulk packs in plain old unsealed
polyethylene or similar bags is probably OK.  If the customer plans to
introduce the boards into the production area, as received, then the bags
probably need to be a non-static generator.

If the purpose of bagging is to protect the lamina from moisture or preserve
solderability, then the bag material probably needs to become one of the
heat sealables with a metal film layer (vapor barrier) bags, and all excess
air needs to be removed.  Even here, some customers may want the bag N2
purged or a desiccant added.

To add to the fun, if one is running continuous production in the assembly
area, the quanitity per pack may vary to match the volumes being run.
(There's a whole lot less labor and material involved by supplier and user
in a 1K bulk pack than in 1000 individual packs.)

And the list goes on - it really gets back to the customer having to make
the requirements clear.

Regards -- Kelly


-----Original Message-----
From: Anne Ledger <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Thursday, December 02, 1999 7:36 AM
Subject: [TN] Bagging Requirements


>Good Morning Technet,
>
>I have a question for the board fabrication group.  We are tasked with
>many different requests with regard
>to "bagging" of boards for shipment.  Some customers require individual
>bag and seal, some want anti-static bags, etc.,
>the vast majority of customers do not call out any spec for bagging.  If
>no spec is issued, is it fair to default to
>the IPC-130?  Is 130 still viable?  Looking for some ideas of what the
>rest of you are doing?
>
>Thanks in advance.
>
>Anne Ledger
>EMDS, Inc.
>[log in to unmask]
>
>##############################################################
>TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
>##############################################################
>To subscribe/unsubscribe, send a message to [log in to unmask] with following
text in
>the body:
>To subscribe:   SUBSCRIBE TECHNET <your full name>
>To unsubscribe:   SIGNOFF TECHNET
>##############################################################
>Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
additional
>information.
>If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
>847-509-9700 ext.5365
>##############################################################

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################