TECHNET Archives

December 1999

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
Date:
Thu, 2 Dec 1999 22:44:32 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (67 lines)
Anne Ledger wrote:
>
> Technetters,
>
> Anybody running the Shadow line from Electro Chemicals?  Any pros and
> cons you'd like to share?

        WOW !!!  This is the second time in two weeks I have had input to the
forum - I may have to lie down after this.

        I have been running Shadow since early 1995.

        Pros:
        Saves on processing time, is quick and simple, load work to the shadow
line and 15 minutes later you can be laminating boards.

        Saves Money.

        Saves water

        Reduces waste products, with less effect on the environment (
Formaldehyde, copper, chelating agents)

        The control process control is simple. You do not need to analyse
solutions immediately before use as long as there is a process  control
routine.

        Much shorter warm up time.

        It is easy to reprocess boards if you encounter problems at prior to
plating.

        The end product is more reliable. Our pull out strenths on landless
vias increased by 50%. Interconection contiuity tests carried out       to
failure was 19 to 21 cycles for electroless copper boards plated up to
25 microns and 38 to 40 cycles for shadowed boards plated up    to 25
microns. One cycle is 20 seconds at 25 deg.C 20 seconds at 266 deg.C 20
seconds at 25 deg.C with 20 seconds transfer time from  cold to hot etc.

        Can be used on all manner of substraights including PTFE,

        You can plate blind vias, micro vias, buried vias, lasered blind vias,
16:1 aspect ratio holes, we do this on boards up to 6 MM

        It works well with pulse plating.

        Cons.

        It is not suitable for photoimageable sequential build up techniqes.


        Roger Hammond

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2