Hi Richard,

I am interested in knowing about your experiment.  Could you please
describe the process, if possible.

Thanks

Alberto




"Hamilton, Richard CLE 4454" wrote:
>
> Hello all,
>
> I too am interested in discussion on this matter. As an assembler using the
> boards we currently have our boards shipped to us in individual bags.
>
> The timing on this question is interesting. We are in the process of
> performing an experiment to determine the electrical effect of different
> conditions on boards that are shipped with and without: bags; peelable mask;
> contamination. The planned completion of the experiment is about 2 weeks
> away at this point. If there is interest, I will post basic test results
> here.
>
> In the meantime, I echo, anyone have any ideas or history?
>
> (Only 23 days to happy day, and 28 days to......well.....who knows what will
> happen!?)
>
> Richard Hamilton
> Clemar Mfg. / Rain Bird
> [log in to unmask]
>
> > -----Original Message-----
> > From: Anne Ledger [SMTP:[log in to unmask]]
> > Sent: Thursday, December 02, 1999 5:23 AM
> > To:   [log in to unmask]
> > Subject:      [TN] Bagging Requirements
> >
> > Good Morning Technet,
> >
> > I have a question for the board fabrication group.  We are tasked with
> > many different requests with regard
> > to "bagging" of boards for shipment.  Some customers require individual
> > bag and seal, some want anti-static bags, etc.,
> > the vast majority of customers do not call out any spec for bagging.  If
> > no spec is issued, is it fair to default to
> > the IPC-130?  Is 130 still viable?  Looking for some ideas of what the
> > rest of you are doing?
> >
> > Thanks in advance.
> >
> > Anne Ledger
> > EMDS, Inc.
> > [log in to unmask]
> >
>
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