Hi!

We've been having an interesting problem concerning packaging.
We ask for the use of silicon conformal coating on our boards
and every time we received them, we could clearly see the marks
left by the pink packaging.  Since their were packed tighthly,
it seems like the packaging would embed into the coating.  Even
if we used sheilding bag we would still end up with problems, the
bag would stick to the board and traces or coating could be found
in the bag using UV light.  The boards were fully cured.

Anyone had the problem before and know what to do about it?

J-F


> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Anne Ledger
> Sent: Thursday, December 02, 1999 8:23 AM
> To: [log in to unmask]
> Subject: [TN] Bagging Requirements
>
>
> Good Morning Technet,
>
> I have a question for the board fabrication group.  We are tasked with
> many different requests with regard
> to "bagging" of boards for shipment.  Some customers require individual
> bag and seal, some want anti-static bags, etc.,
> the vast majority of customers do not call out any spec for bagging.  If
> no spec is issued, is it fair to default to
> the IPC-130?  Is 130 still viable?  Looking for some ideas of what the
> rest of you are doing?
>
> Thanks in advance.
>
> Anne Ledger
> EMDS, Inc.
> [log in to unmask]
>
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