Lou,
On any of my product, I would be concerned with potential "infant mortality"
on any heat sensitive components that were initially submerged, then
subjected to additional heating by whatever solder removal process you may
employ.
Peter A. Phillips
Honeywell Inc.
Defense Avionics Systems
9201 San Mateo Blvd. NE
Albuquerque, NM 87113-2227
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505.828.5078…work
505.530.7147…pager
505.828.6709 ... fax.
M/S NM75-D09A
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-----Original Message-----
From: Lou Hart [mailto:[log in to unmask]]
Sent: Thursday, December 02, 1999 7:55 AM
To: [log in to unmask]
Subject: [TN] Solder-dunked assembly
TechNetters, comments, please, on this situation: I have a printed circuit
assembly that had solder flow over its component side when it went through
the wave. It has quite a few shorts, which could be removed with 1-2 days
work. What concerns might we have about this assembly, once the shorts are
removed?
Lou Hart
Quality Assurance Manager 412-858-6184
Instrumentation Systems Division
Compunetix, Inc.
"With the chart on the wall, with the figures published, let's emulate and
rouse our enthusiasm in production." - State Statistical Bureau of the
People's Republic of China
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