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December 1999

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Subject:
From:
brian carlson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 2 Dec 1999 08:49:42 -0800
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Not only does copper thieving help balance the construction it allows for a more stable core. Thus, reducing expansion and contraction rates during the lamination process. Especially on thinner core construction. Typically though inner layer thieving is not allowed. Normally outerlayer only with approval from the customer. I agree with John. It does delay the process for DFM feedback. It would be nice to see copper thieving built into a design. Outer layer copper thieving also allows more consistent Cu plating characteristics. And better etch results.

Brian

>>> John Anselmo <[log in to unmask]> 12/02 6:50 AM >>>
        Barbara, the answer is yes.  It does help.  If we see a need for
     "copper thieving" to prevent warping, we end up calling the customer.
     This always causes delays.
        As far as the type, we use a 50 mil square on 100 mil centers and
     keep the square anywhere from 20 to 50 mils from any feature.

     John Anselmo
     Hadco - Tech Center Austin
     512-246-5616


______________________________ Reply Separator _________________________________
Subject: [TN] Balanced construction....
Author:  Barbara Burcham <[log in to unmask]> at smtplink-hadco
Date:    12/2/99 8:51 AM


Hey Ya'll,
      The subject has come up....why add copper to signal layers in a
multilayer board if it has no electrical function?
I am in the habit of filling open areas with copper to prevent board
warpage. This does work, doesn't it?
Should copper fill be solid or hatched? Or does it matter?

Help a designer/Help an engineer.

Thanks,
Barbara J. Burcham, CID
PCB Designer
Fairfield Industries
Sugar Land, TX 77478
281-275-7687 Work
281-275-7550 Fax
[log in to unmask] 

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