TECHNET Archives

December 1999

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: GLASS SUBSTRATE
From:
"Ingemar Hernefjord (EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 1 Dec 1999 12:53:06 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (27 lines) 
Strange that you ask, Edward,
we are trying this method ourselves by means of 0.12 micron thick special glass plates. They have to ber diced and GelPak“d also in our case. If you give me one day or two, I will get the adresses.
alea acta est (the die is placed) old roman process engineering expression.
Ingemar Hernefjord



Anyone know of a source for a graduated glass substrate which is suitable
for a Capability study on pick and place equipment. Particularly one
suitable for passive components.
Regards
Edward Brunker

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################

ATOM RSS1 RSS2