Hi all,

        Hope everyone had a good holiday.  Here's a question for you.

        I have completed an accelerated test to determine the voltage
influence on electrochemical migration of copper, under 85C/85%, within a flex
circuit.  However, I have not been too successful in finding an activation
energy from published articles for temperature.  Most references go back to
the late 70s, early 80s, but deal mainly with silver.  However, I don't
believe silver to be representative of copper.  So, next I thought about the
Conductive Filament Formation (CFF, aka Conductive Anodic Filament, CAF)
situation in PCB.  Maybe close?  What do you think?

Thanks everyone,

Glenn

P.S.  I even bought ASM Vol 13 like Ingemar suggested, but not specific
enough.

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