hi,

we have a backplane that is somewhat thicker than this with press fit
connectors and discrete components soldered to it.  the finish is tin lead
plate and fuse.  the fabricator has no problems with with the finish.

phil

-----Original Message-----
From: Darrel Therriault [mailto:[log in to unmask]]
Sent: Tuesday, December 21, 1999 5:01 PM
To: [log in to unmask]
Subject: [TN] B/P Finish


TechNet,

I use a B/P that is .187".  A supplier indicates having difficulty with
HASL as a finish because the board is too thick and is recommending we use
Au.

There are pressfit, SMT and PTH connectors on the B/P.
There are some Rs and Cs as well as some small ICs (SOIC), nothing fine
pitch.

If anyone has a B/P of this thickness and/or components similar to this,
what finish are you using and would you recommend it?  Are there any issues
with intermetalics or embriddlement with gold??

All positives and horror stories appreciated.

Tks.....DT

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