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December 1999

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Subject:
Re: HCl clean of Ni/Au plating
From:
"Michael D. Doty" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 21 Dec 1999 17:44:14 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (59 lines) 
     Craig, Yes HCl is a step between Ni and Au plate. It is used to
     activate the Nickel surface to accept gold plating for better
     adhesion.

     Mike Doty
     PE Hadco TCE


______________________________ Reply Separator _________________________________
Subject: [TN] HCl clean of Ni/Au plating
Author:  Craig Hillman <[log in to unmask]> at smtplink-hadco
Date:    12/21/99 5:00 AM


Hello Technetters,

        Is HCl clean of the nickel pads sometimes a step in the Ni/Au
plating process? If it is, why is it done?

Thanks for your response,
Happy Holidays,
Craig

Dr. Craig Hillman
CALCE Electronic Products and Systems Consortium
University of Maryland
College Park, MD  20742
(301)-405-5316
[log in to unmask]

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