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December 1999

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Subject:
From:
Ryan Grant <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 21 Dec 1999 13:04:15 -0700
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What concentration of HCl is used?

Ryan

>-----Original Message-----
>From:  Larry Tawyea [SMTP:[log in to unmask]]
>Sent:  Tuesday, December 21, 1999 11:52 AM
>To:    [log in to unmask]
>Subject:       Re: [TN] HCl clean of Ni/Au plating
>
>In a message dated 12/21/99 11:20:32 AM Central Standard Time,
>[log in to unmask] writes:
>
><< Hello Technetters,
>
>         Is HCl clean of the nickel pads sometimes a step in the Ni/Au
> plating process? If it is, why is it done?
>  >>
>
>Craig,
>
>When you say plating the nickel pads I'm going to assume you are doing a
>selective plate as opposed to a pattern plate,  In this case there are
>process steps between the nickel and gold plate.  The purpose of the HCl
>clean is to remove the nickel oxide that forms very quickly when the nickel
>is exposed to air.  Hope this answers your question.
>
>Larry Tawyea
>
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