In a message dated 12/21/99 11:20:32 AM Central Standard Time,
[log in to unmask] writes:

<< Hello Technetters,

         Is HCl clean of the nickel pads sometimes a step in the Ni/Au
 plating process? If it is, why is it done?
  >>

Craig,

When you say plating the nickel pads I'm going to assume you are doing a
selective plate as opposed to a pattern plate,  In this case there are
process steps between the nickel and gold plate.  The purpose of the HCl
clean is to remove the nickel oxide that forms very quickly when the nickel
is exposed to air.  Hope this answers your question.

Larry Tawyea

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