In a message dated 12/20/99 9:21:09 PM US Eastern Standard Time,
[log in to unmask] writes:

<< Both the testing and the modeling need to be specific for
 the failures you are interested in, e.g. solder joints,plated-through
 holes/vias, components, insulation resistance, etc. >>

Werner hit the nail on the head.  However, I would like to add that the
testing and modeling need also to be specific for the product design and the
field environment for which it is designed.

David Morrow
Contamination Studies Laboratories. Inc.

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################