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December 1999

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Subject:
From:
Marc Bituagan <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 21 Dec 1999 10:14:47 +0800
Content-Type:
text/plain
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text/plain (27 lines)
Hi all,
     Anyone out there know of a "standard", table, matrix or guideline of sorts
regarding what peel strength value would be most appropriate for different
packages; say SOIC 8, TSSOP's, BGA's.....
      Our customers requiring Tape and reel for these package types usually
provide us with a value range for the peel strength. This would not present a
problem if the range was small but we have customers having ranges from 20-120
gms., 20-100 gms., etc. for peel strength. So what we do is to shoot for the
average of the customer specified range to kinda' play safe.  Is anyone else
doing it this way? or, is there another approach?
       Your $0.02 on the matter please....
Marc

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