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December 1999

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Subject:
From:
David Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 20 Dec 1999 14:44:24 -0600
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Hi Steve! I have done some reflow soldering of the Sn96 alloy using the
"typical" Sn63 rules of thumb but adjusting the temperatures upward and had good
success. The TechNet community has given you some good reminders about avoiding
smoking boards/components which you should check on prior to a trial run (reflow
operators are a bit touchy about their ovens smoking!). The one element of the
reflow recipe I did have to revise was the ability of the flux to do its job
with the higher temperatures - the flux you are using may not be able to work so
contact your flux manufacturer for temperature information.  A nitrogen inert
atmosphere will buy you some reflow profile robustness if it is available to you
too. Good Luck.

Dave Hilllman
Rockwell Collins
[log in to unmask]




"Stephen R. Gregory" <[log in to unmask]> on 12/16/99 05:48:34 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to
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Subject:  [TN] Reflow profiles with SN96 solder



Hi ya'll!

Most all my reflow profiling experience has been with the typical Sn63Pb37
alloys. But we'll be getting some products in here later on that will require
that we use a SN96AG04 alloy (they're boards that go into oil well drill head
instumentation, hot stuff down there!) Liquidous will be up around 221-229?
C.

So should I follow the same rules of thumb when it comes creating a profile
for this stuff...ya' know; don't ramp more than 2-4? C per second, pre-heat
and soak above 150? C for around a minute and a half, then spike it until
you're 20-30? above liquidous, and try to be less than a minute while you're
above liquidous? Or is there some special stuff I should do differently with
this higher melting point temperature alloy?

'preciate it!

-Steve Gregory-

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