Hello Ken,

How many Pads/ "Pins"? With bumps or without bumps like the new, ugly
SANYO E-CSP-Packages?

NSC has an application note for their Micro SMD-Family with 4 or 8
bumps in 0.5mm pitch. AN-1112.PDF, you should be able to locate it
easily under http://www.national.com, but be aware, it has 11 pages
but is about 3 MB big....

For this pitch, they don't recommend anything with vias in pads, but
they have good hints for stencil design.

Maybe it is helpful.

Regards
Matthias Mansfeld

On 20 Dec 99 at 9:29, Ken Patel wrote:

> I am looking for Land Pattern Design for .8mm CSP. I am interested
> in knowing pad size, via hole size and preferred manufacturing
> practice (laser drilled v/s mechanical drilled). Any help will be
> appreciated.
>
> re,
> ken patel
> ______________________________________________________
> Ken Patel                       Phone:  (408) 490-6804
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Matthias Mansfeld Elektronik
* Printed Circuit Board Design and Assembly
Am Langhoelzl 11, D-85540 Haar, GERMANY
Phone: +49-89-4620 0937, Fax: +49-89-4620 0938
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