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December 1999

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Subject:
Re: Bumping Technique
From:
Carey Pico <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 20 Dec 1999 11:24:13 -0800
Content-Type:
text/plain
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text/plain (59 lines) 
Did you say use or has?  MCNC offers gold bumping services.  They're in the
Research Triangle Park area.

Carey
-----Original Message-----
From: jong s kadesch <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Monday, December 20, 1999 9:15 AM
Subject: [TN] Bumping Technique


>Hi Technetters,
>
>Does anyone know who can use bumping technique (possibly Au bumps) to mount
>die to the substrate?  I have 6 mm x 8 mm die that has 160 I/O with 85 um
>pitch.  Thanks in advance.
>
>Happy Holiday!
>
>
>Jong S. Kadesch
>Hardware Engineer
>Unisys Federal Systems at
>562/Component Technologies and Radiation Branch
>NASA-Goddard Space Flight Center
>tel:(301)286-2785
>fax:(301)286-1695
>
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