Hi Technetters,

Does anyone know who can use bumping technique (possibly Au bumps) to mount
die to the substrate?  I have 6 mm x 8 mm die that has 160 I/O with 85 um
pitch.  Thanks in advance.

Happy Holiday!


Jong S. Kadesch
Hardware Engineer
Unisys Federal Systems at
562/Component Technologies and Radiation Branch
NASA-Goddard Space Flight Center
tel:(301)286-2785
fax:(301)286-1695

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