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December 1999

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Subject:
From:
Eric Yakobson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 1 Dec 1999 17:06:42 -0500
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Hi Mike,

I'd first run a Hull cell panel (to isolate the problem from all other
processing steps, i.e. drilling, desmear/e-less and pre-clean).  If the nodular
deposit forms in the Hull cell, I'd filter a fresh portion of the solution and
run another panel in it (to see if particulate matter causes it).  If the
nodules are still there -- the problem is probably in the additive imbalance --
see if replenishment helps.

Eric Yakobson
Alpha PC Fab




"Michael D. Doty" <[log in to unmask]> on 12/01/99 12:12:14 PM

To:   [log in to unmask]
cc:
Subject:  [TN] HELP: Plating Nodules




     Hi again,
              I've researched the archives but am still looking for some
     more info on plating nodules. Does anybody out there info on possible
     causes of nodules.
              I've already gone through the debris related issues and some
     surface conditions is there anymore info available? I'm thinking
     cleaners, copper structure etc..

     Thanks in advance.

     Mike Doty

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