Morning Steve,
You've probably already looked at this but in case you didn't:  verify the
component specifications to ensure the elevated temperature will not cause
degradation.
You should set your oven to provide a soak temperature of no more than 100C
below the liquidus temperature -- this too relates to thermal shock.
Like other solder pastes, the manufacturer should provide the recommended
reflow profile -- then tweek based upon your assembly density to achieve
that end.

Good Luck
Steve Sauer
Xetron Corporation

-----

Steve said..... So should I follow the same rules of thumb when it comes
creating a profile 
for this stuff...ya' know; don't ramp more than 2-4º C per second, pre-heat 
and soak above 150º C for around a minute and a half, then spike it until 
you're 20-30º above liquidous, and try to be less than a minute while you're

above liquidous? Or is there some special stuff I should do differently with

this higher melting point temperature alloy?

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################