I am wondering if anyone has tested the resistivity of 1ply core construction vs 2ply using dielectrics below 5 mils using 1/2oz copper. Does 2 ply material reduce the resistivity of electrical migration between say a VCC and GND? I know using a RTF (Reverse Treat Foil) having a lower copper tooth profile will reduce the chance of electrical migration between planes. At what voltages applied to a VCC layer  will you start to see electrical migration with such a thin dielectric material?  Any tests or feedback of this matter is greatly appreciated!

Rgds,

Brian Carlson

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