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December 1999

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Subject:
From:
Martin Christie <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 16 Dec 1999 17:02:00 +0000
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Jason,

I've been through a similar situation before. If you have to keep the OSP
finish, try reflowing your boards in a Nitrogen atmosphere this will help
the degradation of the OSP. Then keep the time between reflow and wave
solder to a minimum.

Martin
===== Original Message from [log in to unmask] (TechNet E-Mail Forum.) at
12/16/99 12:49 pm
>I am having problems with wave soldering OSP boards.  After the boards have seen
>a heat cycle (reflow), they are impossible to get hole fill on topside without
>first cleaning the boards to remove either oxidation or hardened OSP.  I don't
>know which one I have because I haven't had them analyzed yet.  The flux used to
>wave solder the boards is a very weak customer dictated rosin no clean flux.
>The OSP is Cu106A.  I am not familiar with OSPs.  They won't do HASL either.
>Any insight?  Suggestions?  Assistance?
>
>As it stands now, the process is to flux with high solids water soluble/heat to
>clean the board-->wash off flux-->immediately wave solder with rosin containing
>no clean.  This is not a production process........
>
>Jason Smith
>Process Materials Engineer
>Lexmark Electronics
>
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