In a message dated 12/16/1999 8:07:22 AM US Eastern Standard Time,
[log in to unmask] writes:

>
>  When you use the words "peeling" and "blistering" I am more suspicious of
>  there being a surface contaminant present on the boards at the time of mask
>  application.

This is quite possible.  Another possibility is that the solder mask was
thinned down by the fabricator (to make it go farther).  This is something we
see alot of on boards coming out of China.  The thinning down makes exposed
copper more likely, the adhesion and thermal resistance properties also are
markedly degraded.

Doug Pauls
CSL

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