I am having problems with wave soldering OSP boards.  After the boards have seen
a heat cycle (reflow), they are impossible to get hole fill on topside without
first cleaning the boards to remove either oxidation or hardened OSP.  I don't
know which one I have because I haven't had them analyzed yet.  The flux used to
wave solder the boards is a very weak customer dictated rosin no clean flux.
The OSP is Cu106A.  I am not familiar with OSPs.  They won't do HASL either.
Any insight?  Suggestions?  Assistance?

As it stands now, the process is to flux with high solids water soluble/heat to
clean the board-->wash off flux-->immediately wave solder with rosin containing
no clean.  This is not a production process........

Jason Smith
Process Materials Engineer
Lexmark Electronics

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################