Hey gang,
       A short time back, there were questions regarding this process, and
     I mentioned that Phil Zarrow had some calculations and good
     information on this process.

     Well, G-olly, I just received and opened the SMTA, Journal of
     SMTechnology, Oct. 1999 Volume 12, Issue 4 and on page 13 is "Reflow
     Soldering of Through-hole Components", by Phil Zarrow.

     As is typical of Phil, well done and very thorough, including stencil
     aperture calculations, examples of quality cost savings, etc.,
     etc.....

     So, there ya go! Have fun!

     Jeff Hempton
     UT Electronic Controls

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