Hi Lou
First question is:  Have you performed microsections to determine the cause of
the open?  You can't fix the problem unless you know what it is.
Opens could have been caused by:  inner layer separation, cracked inner layer
foil or a burned conductor etc.  Once we know what the cause was, we can
troubleshoot the process for all things that effect the specific area.

All the bare board tester does is tell you if you have continuity between
areas that should have continuity - it does not predict performance or
assembly success.

Susan Mansilla
Robisan Lab

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