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December 1999

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Subject:
From:
BOB HAYNES <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 14 Dec 1999 14:49:51 -0500
Content-Type:
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text/plain (42 lines)
Ladies and Gentlemen,

My manufacturing department has a question regarding the
acceptance of conformal coating on a quanity of circuit cards.

The question is :

"If there is a bubble between two leads of a component, but the
circuitry is not exposed, is this a reject under IPC-A-610B Para
7.1.2 ?"


Thanks






Bob Haynes
Manager Of Design Engineering
General Atronics Corporation
1200 E Mermaid Lane
Wyndmoor PA 19038
Telephone 215-242-7273
FAX       215-233-9947
email [log in to unmask]

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