IPC-610, latest rev. is most likely the best pictorials available .
You can get even cute and handy wall charts for all to see/learn/admire/talk
over/become trapped upon = ten commandments.
Framed they make just the right work buzzz image "we know what we do here".
And legal videos as well.
Kidding aside, Eric, why i actually wrote :
when we started to place smd electrolyte caps (1/2" cans), replacing th old
ones;
with legs (sm) obviously "nicely tucked" in thermal shade, of even most
dense convection jets,
(not mentioning the heat dissipative effect of the body on the hot jet,
beside the deflection)
we've had to bump up profile 5-10'C just because of that .
Basically, watch out for shady individuals .
Good luck with QC (some say they're humans too)
pk
-----Original Message-----
From: Eric Manrique [mailto:[log in to unmask]]
Sent: Saturday, 11 December 1999 7:09
To: [log in to unmask]
Subject: [TN] Solder joint Visual aids
Hi.
Mi name is Eric Manrique.
I have joined the technet forum a short while a go and i have learned a
lot by simply reading your Q&A.
Two months a go i started to work for a small company situated in
Montreal, Canada. We are a subcontracting company for circuit board
assemblies.
I'm in charge of process, and i tend to have some hard discusions with
my quality inspectors. Any time a solder joint is not nicely spread on
the pad, it does not look stetic or the joint is formed around the leg
but does not grasp it, they call it a cold joint. Witch involves
production stopages. They allways blaim the reflow oven, therefore I
have to re-profile the temperature on the oven to, in most cases, prove
them that the profile is working fine.
It has hapened that i found a profile not properly optimised, but then
again the joint was obviously cold in most cases. [Sanddy look and dull
grey and stay in a lump befor or behind the leg], but most often the
problem is simply bad wetting due to component / board or solder paste
contamination.
My delema is that i have no visual aid to prouve/show the quality
inspectors what a bad wetting or a cold joint realy looks like [they
will not take mi word for it, and justly so beacause its no official
proof] . The IPC has many examples, but when it comes down to SMT
component bad wettings or cold joints, samples are lacking. (its
probably our old edition?)
Is there a document with good visual aid concerning the solder joint
standards, and good examples of non compliance? Would the newest IPC
revision be sufficient?
Thankyou.
Eric Manrique
Process supervisor.
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