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Reply To: | TechNet E-Mail Forum. |
Date: | Fri, 10 Dec 1999 13:51:37 -0500 |
Content-Type: | text/plain |
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Hi All,
Has anyone studied the effects of humidity on the formation of solder
beads (beads that form between the termination's of a chip type
component, not from unreflowed solder spheres) during reflow? Does low
humidity aggravate beading and is there a hypothesis to explain the
condition?
Thanks to all,
Denis Meloche
Heraeus Cermalloy
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