Hi Scott,

        Mil-Std-883E doesn't have the product requirement, but the test method
for solderability (Method 2003) does have a test requirement:

"4.4.1 Solder dipping of gold plated terminations. Gold plated terminations
shall be cycled twice in flux and solder using one or
two solder pots. The first immersion is to scavenge the gold on the
terminations. It is recommended that a separate solder pot
be used for gold plated devices."

Hope that helps,

Glenn

Scott A. Bowles <[log in to unmask]> Wrote:
|
| TechNetters,
| Can anyone point me to a test method in MIL-STD-883 that deals with gold on
| Military assemblies.  I have an understanding that from back to the 60's,
| boards built for Military applications are not to have gold on them or
| actually in the solder joints.  And if they do, then they must be double
| dipped/tinned or something to get rid of the gold.  Any help is greatly
| appreciated.
| Thanks,
| Scott

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