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Subject:	Re: MIL-STD-883D
From:	David Hillman <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Fri, 10 Dec 1999 10:43:22 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (61 lines)

Hi Scott - I think that taking a look at ANSIJ-STD-001B, paragraph 5.4.1 on page
5 is the information you are seeking.

Dave Hillman
Rockwell Collins
[log in to unmask]




"Scott A. Bowles" <[log in to unmask]> on 12/10/99 09:19:32 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to
      [log in to unmask]

To:   [log in to unmask]
cc:

Subject:  [TN] MIL-STD-883D



TechNetters,
Can anyone point me to a test method in MIL-STD-883 that deals with gold on
Military assemblies.  I have an understanding that from back to the 60's,
boards built for Military applications are not to have gold on them or
actually in the solder joints.  And if they do, then they must be double
dipped/tinned or something to get rid of the gold.  Any help is greatly
appreciated.
Thanks,
Scott

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